Welcome to Electronic Innovations!

  • The industry is facing headwinds due to thermal limitations. The proposed thermal solution is so powerful that many customary design rules can be ignored, greatly simplifying the design process.
  • The physical implementation of our thermal architecture opens the door to a host of related benefits: improvements in power density, energy efficiency, design cost and manufacturing cost.
  • Increased power density further enables agile reconfiguration and workload adaptability, with available space for redundant components.
  • The proposed water-cooled modules can be integrated into advanced servers, and the servers integrated into advanced supercomputers.

We offer a new thermal paradigm